- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/3105 - After-treatment
Patent holdings for IPC class H01L 21/3105
Total number of patents in this class: 3448
10-year publication summary
|
414
|
456
|
400
|
495
|
453
|
293
|
192
|
197
|
177
|
178
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 44433 |
881 |
| International Business Machines Corporation | 61636 |
173 |
| Applied Materials, Inc. | 19072 |
170 |
| Tokyo Electron Limited | 13031 |
116 |
| GLOBALFOUNDRIES U.S. Inc. | 6411 |
113 |
| Samsung Electronics Co., Ltd. | 148402 |
100 |
| United Microelectronics Corp. | 4269 |
84 |
| Resonac Corporation | 2951 |
64 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1754 |
63 |
| Lam Research Corporation | 5335 |
52 |
| Fujimi Incorporated | 762 |
51 |
| Micron Technology, Inc. | 26348 |
47 |
| Renesas Electronics Corporation | 5969 |
47 |
| Versum Materials US, LLC | 653 |
47 |
| Kioxia Corporation | 10442 |
44 |
| CMC Materials LLC | 248 |
40 |
| Canon Inc. | 40733 |
37 |
| Yangtze Memory Technologies Co., Ltd. | 2865 |
36 |
| Intel Corporation | 46939 |
35 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1033 |
35 |
| Other owners | 1213 |