- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/3105 - After-treatment
Patent holdings for IPC class H01L 21/3105
Total number of patents in this class: 3393
10-year publication summary
|
414
|
456
|
400
|
495
|
453
|
293
|
191
|
192
|
174
|
129
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43015 |
859 |
| International Business Machines Corporation | 61344 |
172 |
| Applied Materials, Inc. | 18759 |
170 |
| Tokyo Electron Limited | 12795 |
113 |
| GLOBALFOUNDRIES U.S. Inc. | 6425 |
113 |
| Samsung Electronics Co., Ltd. | 147003 |
96 |
| United Microelectronics Corp. | 4242 |
82 |
| Resonac Corporation | 2825 |
64 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1766 |
63 |
| Lam Research Corporation | 5282 |
52 |
| Micron Technology, Inc. | 26251 |
49 |
| Fujimi Incorporated | 743 |
49 |
| Renesas Electronics Corporation | 6001 |
47 |
| Versum Materials US, LLC | 647 |
46 |
| Kioxia Corporation | 10323 |
44 |
| CMC Materials LLC | 247 |
40 |
| Canon Inc. | 40165 |
37 |
| Intel Corporation | 47051 |
35 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1033 |
35 |
| Yangtze Memory Technologies Co., Ltd. | 2676 |
35 |
| Other owners | 1192 |