- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
Patent holdings for IPC class H01L 21/3213
Total number of patents in this class: 5384
10-year publication summary
637
|
509
|
587
|
699
|
666
|
467
|
414
|
357
|
341
|
16
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 40583 |
974 |
Tokyo Electron Limited | 12111 |
411 |
Applied Materials, Inc. | 17720 |
329 |
Samsung Electronics Co., Ltd. | 138729 |
265 |
International Business Machines Corporation | 60095 |
211 |
Lam Research Corporation | 4995 |
210 |
Micron Technology, Inc. | 25791 |
125 |
GLOBALFOUNDRIES U.S. Inc. | 6433 |
95 |
United Microelectronics Corp. | 4102 |
82 |
Kioxia Corporation | 10120 |
82 |
Semiconductor Manufacturing International (Shanghai) Corporation | 1773 |
76 |
Tokyo Electron U.S. Holdings, Inc | 663 |
73 |
Texas Instruments Incorporated | 19418 |
70 |
Boe Technology Group Co., Ltd. | 38828 |
70 |
SK Hynix Inc. | 10784 |
63 |
Samsung Display Co., Ltd. | 32745 |
56 |
Nanya Technology Corporation | 2226 |
52 |
Changxin Memory Technologies, Inc. | 4923 |
44 |
ASM IP Holding B.V. | 1880 |
42 |
Hitachi High-Tech Corporation | 5040 |
42 |
Other owners | 2012 |