• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Patent holdings for IPC class H01L 21/687

Total number of patents in this class: 7925

10-year publication summary

571
727
753
745
733
787
722
693
843
246
2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Principal owners for this class

Owner
All patents
This class
Applied Materials, Inc.
20145
1436
Tokyo Electron Limited
13617
766
Lam Research Corporation
5560
519
Taiwan Semiconductor Manufacturing Company, Ltd.
47734
357
Screen Holdings Co., Ltd.
3114
338
Semes Co., Ltd.
1604
229
Samsung Electronics Co., Ltd.
155224
203
ASML Netherlands B.V.
7785
170
ASM IP Holding B.V.
2319
155
Ebara Corporation
2278
123
Kokusai Electric Corporation
2198
97
Disco Corporation
1945
78
LAM Research AG
194
73
NGK Insulators, Ltd.
5223
70
Kawasaki Heavy Industries, Limited
1644
63
Beijing Naura Microelectronics Equipment Co., Ltd.
711
62
Brooks Automation US, LLC
337
60
Jusung Engineering Co., Ltd.
484
48
Kioxia Corporation
10727
48
Varian Semiconductor Equipment Associates, Inc.
1192
47
Other owners 2983