- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Patent holdings for IPC class H01L 21/687
Total number of patents in this class: 7925
10-year publication summary
|
571
|
727
|
753
|
745
|
733
|
787
|
722
|
693
|
843
|
246
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 20145 |
1436 |
| Tokyo Electron Limited | 13617 |
766 |
| Lam Research Corporation | 5560 |
519 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47734 |
357 |
| Screen Holdings Co., Ltd. | 3114 |
338 |
| Semes Co., Ltd. | 1604 |
229 |
| Samsung Electronics Co., Ltd. | 155224 |
203 |
| ASML Netherlands B.V. | 7785 |
170 |
| ASM IP Holding B.V. | 2319 |
155 |
| Ebara Corporation | 2278 |
123 |
| Kokusai Electric Corporation | 2198 |
97 |
| Disco Corporation | 1945 |
78 |
| LAM Research AG | 194 |
73 |
| NGK Insulators, Ltd. | 5223 |
70 |
| Kawasaki Heavy Industries, Limited | 1644 |
63 |
| Beijing Naura Microelectronics Equipment Co., Ltd. | 711 |
62 |
| Brooks Automation US, LLC | 337 |
60 |
| Jusung Engineering Co., Ltd. | 484 |
48 |
| Kioxia Corporation | 10727 |
48 |
| Varian Semiconductor Equipment Associates, Inc. | 1192 |
47 |
| Other owners | 2983 |