• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Patent holdings for IPC class H01L 21/687

Total number of patents in this class: 7875

10-year publication summary

571
727
753
745
733
779
692
664
826
288
2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Principal owners for this class

Owner
All patents
This class
Applied Materials, Inc.
20459
1430
Tokyo Electron Limited
13854
759
Lam Research Corporation
5652
516
Taiwan Semiconductor Manufacturing Company, Ltd.
48539
356
Screen Holdings Co., Ltd.
3174
337
Semes Co., Ltd.
1678
227
Samsung Electronics Co., Ltd.
158337
201
ASML Netherlands B.V.
7959
170
ASM IP Holding B.V.
2412
150
Ebara Corporation
2343
122
Kokusai Electric Corporation
2237
96
Disco Corporation
1960
78
LAM Research AG
196
72
NGK Insulators, Ltd.
5199
66
Kawasaki Heavy Industries, Limited
1679
62
Beijing Naura Microelectronics Equipment Co., Ltd.
743
61
Brooks Automation US, LLC
332
59
Jusung Engineering Co., Ltd.
499
48
Varian Semiconductor Equipment Associates, Inc.
1182
47
Kioxia Corporation
10854
47
Other owners 2971