- All sections
- C - Chemistrymetallurgy
- C23C - Coating metallic materialcoating material with metallic materialsurface treatment of metallic material by diffusion into the surface, by chemical conversion or substitutioncoating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general
- C23C 16/24 - Deposition of silicon only
Patent holdings for IPC class C23C 16/24
Total number of patents in this class: 1009
10-year publication summary
|
77
|
86
|
76
|
77
|
59
|
64
|
89
|
68
|
91
|
50
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 20375 |
104 |
| Tokyo Electron Limited | 13807 |
74 |
| Sumco Corporation | 1111 |
43 |
| Kokusai Electric Corporation | 2226 |
42 |
| ASM IP Holding B.V. | 2397 |
38 |
| Wacker Chemie AG | 2112 |
31 |
| Shin-Etsu Chemical Co., Ltd. | 6096 |
23 |
| Shin-Etsu Handotai Co., Ltd. | 1307 |
18 |
| Lam Research Corporation | 5635 |
17 |
| L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude | 4117 |
16 |
| Nexeon Limited | 182 |
16 |
| Silcotek Corp. | 73 |
15 |
| Group14 Technologies, Inc. | 120 |
12 |
| Versum Materials US, LLC | 678 |
12 |
| Agilent Technologies, Inc. | 2634 |
11 |
| Tokuyama Corporation | 1477 |
9 |
| QROMIS, Inc. | 97 |
9 |
| Samsung Electronics Co., Ltd. | 157719 |
8 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48302 |
8 |
| American Air Liquide, Inc. | 267 |
8 |
| Other owners | 495 |