- All sections
- C - Chemistry; metallurgy
- C23C - Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general
- C23C 16/24 - Deposition of silicon only
Patent holdings for IPC class C23C 16/24
Total number of patents in this class: 878
10-year publication summary
|
58
|
77
|
86
|
76
|
77
|
58
|
64
|
83
|
67
|
6
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 17720 |
90 |
| Tokyo Electron Limited | 12111 |
65 |
| Sumco Corporation | 1125 |
41 |
| Kokusai Electric Corporation | 1912 |
41 |
| Wacker Chemie AG | 2103 |
28 |
| ASM IP Holding B.V. | 1880 |
26 |
| Shin-Etsu Chemical Co., Ltd. | 5444 |
23 |
| L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude | 3591 |
16 |
| Shin-Etsu Handotai Co., Ltd. | 1290 |
14 |
| Silcotek Corp. | 67 |
12 |
| Agilent Technologies, Inc. | 2674 |
11 |
| Versum Materials US, LLC | 622 |
11 |
| Lam Research Corporation | 4995 |
10 |
| Group14 Technologies, Inc. | 95 |
10 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40583 |
8 |
| American Air Liquide, Inc. | 241 |
8 |
| High-purity Silicon Corporation | 73 |
8 |
| Samsung Electronics Co., Ltd. | 138729 |
7 |
| Dow Corning Corporation | 1018 |
7 |
| Nexeon Limited | 139 |
7 |
| Other owners | 435 |